Conductive silver glue for chip packaging and bonding

Product Category: Conductive Silver Adhesive

Conductive silver glue products cured with high conductivity, thermal conductivity, high temperature resistance and other high reliability performance. The product is suitable for high-speed dispensing, dispensing good conformability, glue point does not deform, not collapse, not spread; cured material moisture, heat, high and low temperature resistance. 80 ℃ low temperature fast curing, good electrical conductivity and thermal conductivity.

Description

Product Specification Parameters

Product Series Product Name Application characteristics
Conductive silver glue DM-7110 The sticking time is extremely short, and there will be no tailing or wire drawing problems. The bonding work can be completed with the smallest dose of adhesive, which greatly saves production costs and waste. It is suitable for automatic glue dispensing, has a good glue output speed, and improves the production cycle.
DM-7130 Mainly used in LED chip bonding. Using the smallest dose of adhesive and the smallest residence time for sticking crystals will not cause tailing or wire It is suitable for automatic glue dispensing, with excellent glue output speed, and When used in the LED packaging industry, the dead light rate is low, the yield rate is high, the light decay is good, and the degumming rate is extremely low. When used in the LED packaging industry, the dead light rate is low, the yield rate is high, the light decay is good, and the degumming rate is extremely low.
DM-7180 Designed for heat-sensitive applications that require low-temperature curing. The sticking time is extremely short, and there will be no tailing or wire drawing problems, The bonding work can be completed with the smallest dose of adhesive, which greatly saves production It is suitable for automatic glue dispensing, has a good glue output speed, and improves the production cycle.
Product line Product Series Product name Colour Typical viscosity

(cps)

Curing time Curing method Volume resistivity(Ω.cm) Store/°C /M
Epoxy based Conductive silver glue DM-7110 Silver 10000 @175°C

60min

Heat curing 〈2.0×10 -4 *-40/6M
DM-7130 Silver 12000 @175°C

60min

Heat curing 〈5.0×10 -5 *-40/6M
DM-7180 Silver 8000 @80°C

60min

Heat curing 〈8.0×10 -5 *-40/6M

Product Features

Highly conductive, thermally conductive, high temperature resistant Good dispensing and shape retention
Curing compound is resistant to moisture, heat, high and low temperatures No deformation, no collapse, no spreading of glue spots

 

Product Advantages

Conductive silver glue is a one-component modified epoxy/silicone resin adhesive developed for integrated circuit packaging, LED new light source, flexible circuit board (FPC) and other industries. It can be used for crystal packaging, chip packaging, LED solid crystal bonding, low temperature soldering, FPC shielding and other purposes.